To Study Characteristics of FET Transistor

Title

To study characteristics of FET transistor

Objectives:

Components and equipments required:D.C power supply .Oscilloscope ,multimeter FET, Resistors

General Instructions:You will plan for Experiment after self study of Theory given below, before entering in the Lab.

Theory:

The acronym ‘FET’ stands for field effect transistor. It is a three-terminal unipolar solidstate device in which current is controlled by an electric field as is done in vacuum tubes.

Broadly speaking, there are two types of FETs :

1. Junction field effect transistor (JFET)
2. Metal-oxide semiconductor FET (MOSFET)

It is also called insulated-gate FET (IGFET). It may be further subdivided into :

1. Depletion-enhancement MOSFET i.e. DEMOSFET
2. Enhancement-only MOSFET i.e. E-only MOSFET

Both of these can be either P-channel or N-channel devices.

As shown in Fig. it can be fabricated with either an N-channel or P-channel though Nchannel is generally preferred. For fabricating an N-channel JFET, first a narrow bar of Ntype semiconductor material is taken and then two P-type junctions are diffused on opposite sides of its middle part [Fig.1 (a)]. These junctions form two P-N diodes or gates and the areabetween these gates is called channel. The two P-regions are internally connected and a singlelead is brought out which is called gate terminal. Ohmic contacts (direct electrical connections) are made at the two ends of the bar-one lead is called source terminal S and the other drain terminal D. When potential difference is established between drain and source, current flows along the length of the ‘bar’ through the channel located between the two Pregions. The current consists of only majority carriers which, in the present case, are electrons. P-channel JFET is similar in construction except that it uses P-type bar and two Ntype junctions. The majority carriers are holes which flow through the channel located between the two N-regions or gates.

Following FET notation is worth remembering:

1. Source. It is the terminal through which majority carriers enter the bar. Since carriers come from it, it is called the source.
2. Drain. It is the terminal through which majority carriers leave the bar i.e. they are drained out from this terminal. The drain to source voltage VDS drives the drain current ID.
3. Gate. These are two internally-connected heavily-doped impurity regions which form two P-N junctions. The gate-source voltage VGS reverse biases the gates.
4. Channel. It is the space between two gates through which majority carriers pass from source-to-drain when VDS is applied. Schematic symbols for N-channel and P-channel JFET are shown in Fig.1 (c). It must be kept in mind that gate arrow always points to N-type material.

Static Characteristics of a JFET

We will consider the following two characteristics:

1. Drain characteristic: It gives relation between ID and VDS for different values of VGS (which is called running variable).
2. Transfer characteristic: It gives relation between ID and VGS for different values of VDS. We will analyze these characteristics for an N-channel JFET connected in the common-source mode as shown in Fig. 2. We will first consider the drain characteristic when VGS= 0 and then when VGS has any negative value upto VGS(off).

JFET Drain Characteristic With VGS = 0

Such a characteristic is shown in Fig. 3.

It can be subdivided into following four regions :

1. Ohmic Region OA: This part of the characteristic is linear indicating that for low values of VDS, current varies directly with voltage following Ohm's Law. It means that JFET behaves like an ordinary resistor till point A (called knee) is reached.
2. Curve AB In this region, ID increases at reverse square-law rate upto point B which is called pinch-off point. This progressive decrease in the rate of increase of ID is caused by the square law increase in the depletion region at each gate upto point B where the two regions are closest without touching each other.

3. Pinch-off Region BC: It is also known as saturation region or ‘amplified’ region. Here, JFET operates as a constant-current device because ID is relatively independent of VDS. It is due to the fact that as VDS increases, channel resistance also increases proportionally thereby keeping ID practically constant at IDSS. It should also be noted that the reverse bias required by the gate-channel junction is supplied entirely by the voltage drop across the channel resistance due to flow of IDSS and none by external bias because VGS = 0.
4. Breakdown Region: If VDS is increased beyond its value corresponding to point C (called avalanche breakdown voltage), JFET enters the breakdown region where ID increases to an excessive value. This happens because the reverse-biased gate-channel P-N junction undergoes avalanche breakdown when small changes in VDS produce very large changes in ID. It is interesting to note that increasing values of VDS make a JFET behave first as a resistor (ohmic region), then as a constant-current source (pinch-off region) and finally, as a constantvoltage source (breakdown region).

Procedure:

1. Connect the circuit as shown in fig 4.
2. Let VDS =(0,0.5,1,1.5,2,2.5,3,4,5 )v measure ID.
3. Repeat step 3 for VGS =(0.5,1,1.5,2,2.5,3,3.5,4,4.5) V.

Observation Table:

Conclusion: